London (May 13, 2004)–London-based Linea Research was formed in 2003 to design, develop and market professional OEM audio technology. Now the company is being officially launched by its board, which includes Davey Smalley (sales director), Ben Ver (engineering), Paul Williams (R&D), and Pip Wilson (production).
Linea’s sales director Davey Smalley, formerly sales manager at BSS Audio, explained the company’s philosophy, noting, “Our potency lies with integrating the key technologies of the future, initially focused towards high power amplifier modules for integration within OEM loudspeakers. Consequently we’re concentrating on switching power supplies, PWM amplifiers, DSP and networking.”
With these four technologies, Smalley believes that Linea will provide flexible solutions to the industry. “We’re not fixed in product strategy or routes to market; rather we are combining our design experience with these modern technologies to create the building blocks from which a range of complete of solutions will flow.”
Linea’s initial products, its X-Pod series of loudspeaker power modules, have already been adopted by several pro audio manufacturers and also high-end monitor and hi-fi companies. For example, the X-Pod 2500 DSP provides two channels of PWM amplification integrated with a one input, two output 96kHz DSP, all powered from a universal mains input switching power supply. Minimal dimensions combined with thermal design make convection cooling an option and precise DSP configuration with monitoring is enabled by Linea’s Podware application.
Linea’s belief that networking is the future of powered speaker systems has resulted in another technology building block, its ObCom protocol. Williams offered, ” ObCom is a versatile Object Oriented messaging technology that underlies all our products. It is suitable for local control of one unit or configuration and monitoring of hundreds of devices spread across numerous sites and connected via the Internet. ObCom is the fabric that binds the various parts of a system into one integrated whole, providing seamless connectivity within products, between devices, and across networks.”