T-funk is Surrounded by Dysonics

Telefunken Elektroakustik has partnered with Dysonics on an eight-capsule, 360-degree microphone array for immersive audio and VR capture.
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South Windsor, CT (November 17, 2015)—Telefunken Elektroakustik has partnered with Dysonics on an eight-capsule, 360-degree microphone array for immersive audio and VR capture.

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Using the Samsung Gear platform, the system features what is reportedly the first solution to combine 360-degree motion-tracked audio with 360-degree video.

"We think anyone tracking immersive audio will want to sample this technology," said Bill Ryan, design engineer at Telefunken. "Dysonics is an ideal partner for us as we push forward into exciting new opportunities to deliver sound to recording professionals and audiophiles alike."

In 2012, Dysonics emerged from the UC Davis technology incubator ETTC to bring to market 3D audio and motion tracking for headphones. Based in San Francisco, the privately-held company is comprised of research and industry veterans who have worked with UC Davis, Stanford University, University of Texas, Microsoft, Adobe and Live Nation.

At the core of the offering is Dysonics' proprietary RondoMic, a patented mic array that houses eight custom omni-directional Telefunken M60 FET microphones that capture sound environments in 360 degrees. Via patented spatial and motion-tracking audio software, Dysonics is able to stitch the eight recordings together in real time and faithfully reproduce the environment over headphones.

Dysonics
www.dysonics.com

Telefunken
www.telefunken-elektroakustik.com